doc. no : qw0905- rev. : date : data sheet low current round type led lamps lhr3330/t-pf ligitek electronics co.,ltd. property of ligitek only lhr3330/t-pf 20 - mar. - 2008 a lead-free parts pb
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only part no. lhr3330/t-pf page 1/5 8.6 5.0 5.9 1.5max 0.5 typ 1.0min 25.0min 2.54typ 7.6 30 60 0 100% 50%75% 25% 0 25% -30 -60 50% 75% 100%
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current part no. lhr3330/t-pf 100 -40 ~ +100 -40 ~ +85 ir 10 ratings hr 100 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 36 viewing angle 2 1/2 (deg) min. 15 2 min. 1.5 forward voltage @ ma(v) max. 2.0 peak wave length pnm 660 spectral halfwidth nm 20 typ. luminous intensity @2ma(mcd) 28 emitted red part no lhr3330/t-pf material gaalas lens color red diffused
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0 0.5 -40-20-020 600650 0 2.03.04.05.0 4060 0.8 -0 -20 -404060 20 0 0.5 0.9 1.0 1.1 1.2 1.0 1.5 2.0 650700750 0.5 1.0 1.0 1.5 2.0 2.5 3.0 100 80100 80 2.5 3.0 hr chip page 3/5 part no. lhr3330/t-pf
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 0 0 25 preheat 50 2 /sec max 100 time(sec) 150 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 260 temp( c) 2.wave soldering profile 260 c3sec max 5 /sec max page 4/5 ligitek electronics co.,ltd. property of ligitek only part no. lhr3330/t-pf
reference standard ligitek electronics co.,ltd. property of ligitek only mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. low temperature storage test high temperature high humidity test thermal shock test solder resistance test solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test item operating life test reliability test: 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition description this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 part no. lhr3330/t-pf
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